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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 7502 Switch Chassis (JD242C)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
Includes background illuminated displays with
gas discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in
product
1
0
0
0
0
0
0
0
0
0
0
Page 1
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Summary of Contents for HP 7502
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 3.1.1 Guidance of treatments to the product: Figure 1 Front of HP 7502 EL-MF877-00 Page 2 Template Revision B...
- Page 3 Figure 2 Rear of HP 7502 Unscrew the screws on mounting angle 2, and then remove mounting angle 2; Unscrew the screws on cabling rack 3, and then remove cabling rack 3 from mounting angle 2; Unscrew the screws on front panel 4, and then remove front panel 4;...
- Page 4 Remove film 4-5 from front panel 4-1. 3.1.3 Guidance of treatments to module 5: Figure 4 Treatments to module 5 Unscrew the screws on PCB 5-2, and then remove PCB 5-2; Remove shielding finger 5-3 from front panel 5-1; Remove film 5-4 from front panel 5-1. 3.1.4 Guidance of treatments to blank panel 6: Figure 5 Treatments to blank panel 6 Remove shielding finger 6-2 from blank panel 6-1;...
- Page 5 Figure 6 Treatments to blank panel 8 Remove shielding finger 8-2 from blank panel 8-1. 3.1.6 Guidance of treatments to blank panel 9 Figure 7 Treatments to blank panel 9 Remove film 9-2 from blank panel 9-1; Remove shielding finger 9-3 from blank panel 9-1. 3.1.7 Guidance of treatments to fan module 10 EL-MF877-00 Page 5...
- Page 6 Figure 8 Treatments to fan module 10 Remove the three fans 10-2 from fan frame 10-1; Remove plug 10-3 from fan frame 10-1; Remove the four wire mounts 10-4 from fan frame 10-1; Unscrew the screws on PCB 10-5, and then remove PCB 10-5; Remove shielding finger 10-6 from fan frame 10-1;...
- Page 7 capacitor height is more than 25 0.59% Fe recycling 0.75% Fe recycling 10-1 2.08% Fe recycling 10-2 98*3 1.42% Pla recycling 10-5 Complex PWB 0.16% The surface of PCB is greater than 10 square centimeters 3.86% Fe recycling Complex PWB 3.51% The surface of PCB is greater than 10...