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LG U8500 Service Manual
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LG U8500 Service Manual

LG U8500 Service Manual

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Service Manual
U8500
Date: February, 2006 / Issue 1.0

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Summary of Contents for LG U8500

  • Page 1 Service Manual U8500 Date: February, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    3.10.12 Trans Flash ........67 3.5.6 Dual band GSM power amplifier 3.11 Main Features ........68 (U1005) ..........32 3.11.1 LG-U8500 Main features ....68 3.5.7 GSM transmit VCO (U1003) ....34 3.11.2 LG-U8500 Main Components ..69 3.5.8 UMTS Rx RF filter (FL1001) ....34 3.5.9 VCTCXO (X1000) ......35...
  • Page 3 Table Of Contents 4. TROUBLE SHOOTING ....74 6. BLOCK DIAGRAM ......141 4.1 RF Component........74 6.1 BLK diagram ........141 4.2 SIGNAL PATH ........75 6.2 GSM & WCDMA RF Block....142 4.3 Checking VCXO Block ......76 6.3 Interface Diagram ........144 4.4 Checking Ant. SW Module Block ...79 7.

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 98.8 X 49.0 X 18.2 mm Weight 93 g (with 800mAh Battery) Power 4.0V normal, 800 mAh Li-Polymer Talk Time Over 125 min (WCDMA, Tx=12 dBm, Voice) (with 800mAh) Over 160 min (GSM, Tx=Max, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] -20 ~ +60 °C Operation Temp -20 ~ +70 °C Storage Temp Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ.
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensivitivity Level -106.7dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity(ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and...

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 4.0 mA Under 384 mA Under 533mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 3.6 mA Under 300 mA (Paging=9period) (Tx=Max) Under 5.3 mA (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ±3 dB Receiving Loudness Rating (RLR) -15 ±3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD) Refer to Table 30.4...

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 800 mAh • Charging Time : Max 3.5 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3.1 General Description The U8500 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U8500 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF U8500 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U8500’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF - 21 -...

  • Page 21: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter. The down-converted baseband outputs are routed to low-pass filters (one I and one Q) having pass- band and stop-band characteristics suitable for DSWCDMA processing. The filter outputs are buffered and passed on to the MSM6250 IC for further processing.

  • Page 24: Transmitter

    PA. The PA device used in U8500 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Phase-Locked Loop

    AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U8500). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.

  • Page 26: Transceiver Pll (Pll1)

    3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.

  • Page 27: Off-Chip Rf Components

    The antenna switch module allows multiple operating bands and modes to share the same antenna. In the U8500 design, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS-1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals.

  • Page 28: Umts Duplexer (Fl1000)

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the U8500 typical losses: UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.
  • Page 29 3. TECHNICAL BRIEF A low current (VCONT) pin provides improved operating efficiency in the low RF power range. To further improve efficiency in this range, a separate VBIAS pin can be directly connected to the battery, which allows reducing VCC1 and VCC2 voltages to 0.8 V to achieve very low power consumption. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module.

  • Page 30: Thermistor (Rt1000)

    Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The U8500 uses National Semiconductor LMV225TLX power detector IC. In Figure 1.5.5-1, R1 is set to 1.8kΩ resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.

  • Page 31: Dual Band Gsm Power Amplifier (U1005)

    3. TECHNICAL BRIEF Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.6 Dual band GSM power amplifier (U1005) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
  • Page 32 3. TECHNICAL BRIEF Figure 3.5.6-1 GSM PA functional block diagram - 33 -...

  • Page 33: Gsm Transmit Vco (U1003)

    3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U1003) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .

  • Page 34: Vctcxo (X1000)

    3.5.10 Bluetooth (U406 : LBDA254AN0, ANT400 : LDA31 ) The MSM6250 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the U8500. - 35 -...
  • Page 35 3. TECHNICAL BRIEF Figure 3.5.10-1 Bluetooth system architecture - 36 -...

  • Page 36: Bb Technical Description

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Baseband(DBB/MSM6250) 3.6.1 General Description A. Features(MSM6250) • The ARM926EJ-S microprocessor can operate at up to 150 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 37: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture USIM PM6650 Receptacle Receptacle BLUETOOTH SPEAKER GSM TX SPEAKER Quadband Quad TX VCO RECEIVER GSM RX SP7T 900/1800/1900 RTR6250 RX FILTER MSM6250 JACK(12pin) WCDMA TX 1.3M UMTS CAMERA UMTS FILTER MAIN WCDMA RX UMTS FILTER SDRAM + RFR6250...

  • Page 38: Block Diagram(Msm6250)

    3. TECHNICAL BRIEF 3.7.1 Block Diagram(MSM6250) HK ADC USB I/F 19.2M UART General Purpose GSM/GP UMTS NAND & Processor SDRAM Tx/Rx I/Q Tx/Rx I/F SBI for PM6650 Stereo Speaker VOCODER CODEC Receiver SBI for RF IC USIM Controller Figure 3.7.1-1 Simplified Block Diagram of MSM6250 - 39 -...

  • Page 39: Subsystem(Msm6250)

    3. TECHNICAL BRIEF 3.8 Subsystem(MSM6250) 3.8.1 ARM Microprocessor Subsystem The MSM6250 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650 devices.

  • Page 40: Wideband Codec

    3. TECHNICAL BRIEF 3.8.6 Wideband CODEC The MSM6250 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.

  • Page 41: Uart

    3. TECHNICAL BRIEF 3.8.10 UART There are three UARTs in the MSM6250 ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.11 USB The MSM6250 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 42: External Memory Interface

    • 2-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY9000AC00C0GG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY9000AC00C0GG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table 3.9-1 External memory interface for U8500 - 43 -...

  • Page 43: H/W Sub System

    3. TECHNICAL BRIEF 3.10 H/W Sub System 3.10.1 RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 44 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. the others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA TX Power Amp Enable •...

  • Page 45: Msm Sub System

    3. TECHNICAL BRIEF 3.10.2 MSM Sub System 3.10.2.1 SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 46 Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6250. U8500’s USB interface uses the PM6650 internal logic for USB Transceiver. Name...
  • Page 47 3. TECHNICAL BRIEF MSM6250_USB Block PM6650_USB Block FLSH_DRV_N 1005 RESET_IN_N PON_RESET_N VREG_USB C412 USB_ID VREG_5V USB_OE_N USB_OE_N VSW_5V D401 USB_CNT_N USB_CTL_N USB_VBUS USB_VBUS USB_DAT USB_DAT RB521S-30 USB_D+ USB_D_P 4.7u USB_SE0 USB_SE0 C450 USB_D- USB_D_M VBAT_TEMP GP1_DRV_N(MPP7) R408 C413 KYBD_BACKLIGHT PM_ON_SW_N Figure 3.10.2.3-2 Schematic of USB block(MSM6250 Side &...
  • Page 48 3. TECHNICAL BRIEF 3.10.2.4 HKADC(House Keeping ADC) The MSM6250 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.

  • Page 49: Power Block

    3. TECHNICAL BRIEF 3.10.3 Power Block 3.10.3.1 General MSM6250, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6250, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO. Major power components are : PM6650(U402) : Phone power supply BH28FB1WHFV(U411) : LCD Power supply QST4(Q403,Q404) : External charger supply switching SI3493DV (Q402) : Main Battery charging control...
  • Page 50 3. TECHNICAL BRIEF Figure 3.10.3.2-1 PM6650 Functional Block Diagram - 51 -...
  • Page 51 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 4.2V~3.82V 3.81V~3.75V 3.74V~3.68V 3.67V~3.51V 3.50V~3.28V 2~0 (%) 100~75 (%) 75~50 (%) 50~25 (%) 25~2 (%) U8500 Battery Bar Display(Stand By Condition) - 52 -...
  • Page 52 3. TECHNICAL BRIEF 3.10.3.3.1 Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 53 3. TECHNICAL BRIEF 3.10.3.3.2 Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3 Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 54: Key Pad

    3. TECHNICAL BRIEF 3.10.4 Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’Key is connected On_SW to PMIC(PM6650) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 HOT1 (VT) HOT2 (H3G) HOT3 (MENU) CLR (Clear) FUNC_1 Side key (camera) ROW1...

  • Page 55: Camera Interface

    3. TECHNICAL BRIEF 3.10.5 Camera Interface U8500 Installed a 1.3M Pixel CMOS VGA Camera. Below figure show the camera board to board connector and camera I/F signal. CONNECTOR VREG_MSMP_2.7V CN501 CAM_DATA(7) CAM_P_DOWN HB-1M1005-600JT CAM_DATA(6) CAM_MCLK FB502 I2C_SDA CAM_DATA(3) FB501 CAM_DATA(0)
  • Page 56 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

  • Page 57: Folder On/Off Operation

    3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U600 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6250 GPIO80. FOLDER_SENSE R600 VREG_MSMP_2.7V...

  • Page 58: Camera Direction Detection

    3. TECHNICAL BRIEF 3.10.7 Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_HALL_IC R508 U500 VREG_MSMP_2.7V MRSS32W CAM_SENSE C512 C513 0.1u Figure 3.10.7-1 Camera Direction Detection - 59 -...

  • Page 59: Keypad Light

    3. TECHNICAL BRIEF 3.10.8 Keypad Light There are 22 blue LEDs on Top side in board backlight circuit, which are driven by KEYBD_BACKLIGHT line form PM6650(note, one LED is not mounted). Key Pad backlight controlled by PM6650. KEY_BACK_LIGHT LD602 R650 LD616 LD617 R666...

  • Page 60: Lcd Module

    3. TECHNICAL BRIEF 3.10.9 LCD Module Vibrator MAIN Receiver Back LOUD SPK MODULE Light LOUD SPK Figure 3.10.9-1 LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 65K Color TFT 176 * 220 Pixel (260K Color support) 96 * 96 Pixel HD66784(RENESAS) Graphic Controller Driver Main &...

  • Page 61: Display & Lcd Fpc Interface

    3. TECHNICAL BRIEF 3.10.10 Display & LCD FPC Interface LCD module is connected to Main board with 50-pin BtoB connector (CN600_AXT450164) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in LCD FPCB module. The LCD is controlled by 16-bit EBI2 in MSM6250 1 : NC 26 : KEY_ROW(3) : MOD_KEY 2 : VCC_2.8V : LCD Power...

  • Page 62: Audio And Sound

    3. TECHNICAL BRIEF 3.10.11 Audio and Sound 3.10.11.1 Overview of Audio & Sound path SUB b'd Head Set Conn. Jack Head_Set LCD Conn Module Receiver MSM6250 (U200) LCD Conn Stereo Speaker Module SUB b'd Head Set Head_set MIC Conn. Jack Figure 3.10.11.1-1 Audio &...
  • Page 63 3. TECHNICAL BRIEF 3.10.11.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250). This transmitted signal is reformed to fit in GSM &...
  • Page 64 U8500 schematics DAUGHTER_HEADSET Head Set Jack BLK C914 R905 2.2K R903 CN901 VREG_MSMP_2.7V R907 2.2K MICBIAS MIC2P MIC2N HP_OUT_L C911 HP_OUT_R C907 EAR_SENSE_N MULTI_ADC HOOK_SENSE_N C915 C917 C931 C932 C-1827541 D901 UCLAMP0505A Figure 3.10.11.2-2 U8500 SUB b’d schematics - 65 -...
  • Page 65 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C538 C537 SP0102BE3 U505 MIC1N C536 0.022u C534 0.022u C535 MIC1P C533 Audio Amp for loud Speaker Audio AMP U502 TPA2010D1YZF C507 0.022u 80.6K AMP_PWR R504 PVDD C509 0.022u 80.6K HPL_R R507 R500 ⇒...

  • Page 66: Trans Flash

    3.10.12 Trans Flash MSM6250 BLK BT_CLK_GPIO[25] BT_SBST_GPIO[24] BT_SBCK_GPIO[23] BT_SBDT_GPIO[22] BT_TX_RN_N_GPIO[21] BT_DATA_GPIO[20] Trans Flash BLK R920 <= from PM6650 VREG_MMC_3.0V S900 500873-0802 DAT2_RSV CD_DAT3_CS MMC_CD CMD_DI MMC_CMD CLK_SCLK MMC_CLK DAT0_DO MMC_DATA DAT1_RSV C905 0.1u U8500 SUB b’d schematics - 67 -...

  • Page 67: Main Features

    3. TECHNICAL BRIEF 3.11 Main Features 3.11.1 LG-U8500 Main features - Folder Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Dual color LCD(Main:260K TFT, Sub:65K TFT) - 1.3M Pixel CMOS VGA Camera - 15*14 pi Stereo speaker - Stereo Head_set...

  • Page 68: Lg-U8500 Main Components

    3. TECHNICAL BRIEF 3.11.2 LG-U8500 Main Components SUB Top Side MAIN Bottom Side MAIN Top Side SUB Bottom Side 1.3M Camera Module U8500 LCD & Folder Assy Stereo Headset - 69 -...
  • Page 69 3. TECHNICAL BRIEF 3.11.2.1 Main Top Side U411 U600 U601 U502,U503 RA600 CN602 CN601 LD614 Reference Description Reference Description U411 LCD 2.8V LDO U601 LCD Backlight power charge pump U600 Folder close(Flip) detection IC U502, U503 Audio Amp(D-class) Key Sense control signal(ROW[]) RA600 CN602 Camera hot side key...
  • Page 70 3. TECHNICAL BRIEF 3.11.2.2 Main Bottom Side U500 U501 FL600 D602,D603 CN600 CN500 CN501 D600 U400 U200 X200 U301 X400 TR1000 U402 U300 X1000 Q400,Q401 U401 J300 Q404 U505 CN503 Q403 Cn502 Q402 Reference Description Reference Description U501 Camera Dual LDO(2.7V/1.8V) U500 Camera direction detection IC D602, D603...
  • Page 71 3. TECHNICAL BRIEF 3.11.2.2 Main Bottom Side(continued) U500 U501 FL600 D602,D603 CN600 CN500 CN501 D600 U400 U200 X200 U301 X400 TR1000 U402 U300 X1000 Q400,Q401 U401 J300 Q404 U505 CN503 Q403 CN502 Q402 Reference Description Reference Description Q400, Q401 N/P-MOS FET for WCDMA PAM TR1000 TR for signal Buffering power control...
  • Page 72 3. TECHNICAL BRIEF 3.11.2.3 SUB Bottom Side CN901 S900 U901 BAT900 D901 3.11.2.4 SUB Top Side CN902 Reference Description Reference Description S900 Trans Flash Socket CN901 Headset Jack U901 TVS for Trans flash data signal BAT900 Back Up battery D901 TVS for audio signal CN902 24pin connector for MAIN PCB...

  • Page 73: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component X1000 U1001 FL1000 U1000 U1002 U1006 U1004 SW1002 ANT1001 U1005 ANT1000 U1003 ANT500 RF component (Bottom) Reference Description Reference Description X1000 VCTCXO(19.2MHz) U1001 HDET IC U1000 WCDMA Receiver IC(RFR6250) FL1000 WCDMA Duplexer U1004 GSM/WCDMA Transceiver IC U1002...

  • Page 74: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH WCDMA Tx P ATH WCDMA Rx P ATH GSM Tx P ATH GSM Rx P ATH DCS/PCS Tx P ATH DCS Rx P ATH GSM/DCS/P CS Rx PATH PCS Rx P ATH - 75 -...

  • Page 75: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X1000 (VCXO) is used WCDMA TX part, GSM part and BB part. - 76 -...
  • Page 76 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C1010 1000p VREG_TCXO_2.85V C1004 C1003 1000p 0.1u 19.2MHz X1000 R1002 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C1005 C1009 0.01u 1000p C1011 100p TCXO_PM...
  • Page 77 4. TROUBLE SHOOTING Check TP1 VCC of VCXO VCC ≥ 2.8V Check PMIC Check TP2 TRK_LO _ADJ 3V≥Voltage≥0V Check MSM Check TP3,4 ,5 With Oscilloscope Check solde ring 3V≥Voltage≥0V and compon ents VCXO is OK Check oth er part - 78 -...

  • Page 78: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block ANT_SEL2 M054E ANT_SEL1 ANT_SEL0 VREG_RFRX_0_2. 85V Antenna Switch Block(Bottom) ANT1000 ANT1001 SW1002 C1230 KMS-512 C1112 L1035 L1034 0.5p C1111 4.7nH 15nH M054E U1006 L1031 7.5nH FXL4T245BQX U1008 VREG_RFRX_0_2.85V VCCA CTRL1 RX_DCS1 VCCB CTRL2 RX_DCS2...
  • Page 79 4. TROUBLE SHOOTING Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level Check VCC 2.5V < Voltgae < 3.0V TP1 VREG_RFRX_0_2.85V Check the Logic in each mode - 80 -...

  • Page 80: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check VCXO 19.2M Hz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx Level 6. Re-download SW & CA L. - 81 -...

  • Page 81: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 4.3 4.5.2 Checking Ant. SW module Refer to 4.4 4.5.3 Checking RF TX Level Test Point (RF TX Level) ANT1000 ANT1001 SW1002 C1230 KMS-512 C1112 L1035 L1034 0.5p 4.7nH 15nH C1111 M054E U1006 L1031...
  • Page 82 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phon e Tx is ON and PDM is 450 Check TP1 RF Tx Lev el is OK Over 21dBm ? Check TP2 Check FEM Over 19dBm ? Check TP3 Check Du ple xer Over 16dBm ? Check TP4...

  • Page 83: Checking Pam Block

    4. TROUBLE SHOOTING 4.5.4 Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control P A_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal P AM_OUT PAM_IN...

  • Page 84: Check Rf Rx Level

    4. TROUBLE SHOOTING 4.5.5 Check RF Rx Level Bias1 Test Point (RF Rx Level) ANT1000 ANT1001 SW1002 C1230 KMS-512 C1112 L1035 L1034 0.5p 4.7nH 15nH C1111 C1055 33p M054E IMT_RX_P U1006 L1031 7.5nH FXL4T245BQX U1008 L1011 VREG_RFRX_0_2.85V VCCA CTRL1 RX_DCS1 VCCB 3.9nH CTRL2...
  • Page 85 4. TROUBLE SHOOTING Set the Phon e Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/ w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Du plexe r Signal exist? Check TP4 Check RF R6250 Signal exist?

  • Page 86: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & C AL. - 87 -...

  • Page 87: Checking Vco Block

    4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point (TXVCO Level) 925-960 MHz VDDA11 R1037 C1086 TX_MOD_CP 1000p VDDA12 L1015 C1083 C1085 C1084 (PPS) TX_VCO_FB 9.1nH 120p 1000p L1028 10nH C1079 R1036 MQW5V0C869M U1003 FB1000 R1027 VREG_RFTX_2.85V R1032 R1025 GSM_TX_VCO_0_EN_N OUT_GSM R1026 100 OUT_DCSPCS...
  • Page 88 4. TROUBLE SHOOTING START Check TP1 Check RTR6250 0.5V < TP1 < 2.5V Check TP2, TP3 If GSM TP2=High , TP3=Low Check Soldering If DCS/PCS TP2=Low , TP3=High & MSM6250 Check TP4 Check PMIC(U501) 2.8V < TP4 < 3.0V Check TP5, TP6 Check Sol d ering of 0dBm <...

  • Page 89: Checking Ant. Sw Module

    4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 3.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) ANT1000 ANT1001 ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM 900 TX HIGH GSM 900 RX/WCDMA DCS1800/PCS1900 TX HIGH HIGH SW1002 C1230 DCS 1800 RX HIGH PCS 1900 RX...
  • Page 90 4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31d Bm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module (U207) If TP3 over 25dBm ? Refer to chapter 3.4 Check PAM Block (U209) Check TXVCO (U210)

  • Page 91: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.

  • Page 92: Checking Rf Rx Block

    4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block DCS.RX PCS.RX GSM.RX Test Point (RF Rx Level) L1032 3.3nH L1018 3.6nH 1930-1990 MHz C1088 1000p L1019 3.6nH L1033 3.3nH VREG_RFTX_2.85V C1093 VREG_RFRX_0_2.85V L1029 5.1nH C1089 0.1u L1016 7.5nH 1805-1880 MHz C1087 1000p C1092 R1038...
  • Page 93 4. TROUBLE SHOOTING Set the Phon e Rx is ON Check Resolderin g soldering Check Chan ge FEM & buffe r FEM & buffe r Chan ge th e board - 94 -...

  • Page 94: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 95 4. TROUBLE SHOOTING BLUETOOTH R513 VREG_MSMP_2.7V R514 VREG_BT_2.85V TP402 TP411 UART_TXD TP412 UART_RXD TP413 C590 PM_ON_SW_N 2.5p U504 BT_CLK CLK_REF SBST BT_SBST C591 C592 SBCK BT_SBCK VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VDD_A RX_BB_TX_BB BT_DATA C514 1000p LDO1 XTAL_IN TCXO_BT LDO2 RB06A VREG_BT_2.85V C401...
  • Page 96 4. TROUBLE SHOOTING Set the Phon e Rx is ON Check BT Antenn a TP1 < -6dBm soldering TP2 > 2.5V Replace PCB TP3 > 2.8V Replace PMIC @TP4 @TP5 Replace PCB 19.2MHz ? 19.2MHz ? Repla ce BT module Chan ge U400 (U504) - 97 -...

  • Page 97: Power On Trouble

    4. TROUBLE SHOOTING 4.8 Power ON Trouble Power On sequence of U8500 is : PWR(END) key press -> PM_ON_SW_N go to low(D603),PM6650 KPDPWR_N pin(24) -> PM6650 Power Up -> VREG_MSMC_1.375V(C406), VREG_MSME_1.8V(C408), VREG_MSMP_2.7V(C436), VREG_MSMA_2.6V(C434), VREG_TCXO_2.85V(C416) power up and system reset assert to MSM ->...
  • Page 98 4. TROUBLE SHOOTING 19.2MHz(C402) VREG_MSMC_1.375V MSM6250 VREG_MSME_1.8V 19.2MHz(R413) VREGC_MSMP_2.7V PM6650 32.768KHz VREGC_MSMA_2.6V VREG_TCXO_2.85V - 99 -...

  • Page 99: Usb Trouble

    4. TROUBLE SHOOTING 4.9 USB Trouble USB Initial sequence of U8500 is : USB connected to U8500 -> USB_VBUS(U401 Pin_4) go to 5V -> USB_D+(U401 Pin_1) go to 3.3V -> 48M Crystal on -> USB_DATA(TP_200) is triggered -> USB work. Start...

  • Page 100: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.10 SIM Detect Trouble USB Initial sequence of U8500 is : VREG_USIM_2.85V(C409 of PM6650) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered -> USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card...

  • Page 101: Key Sense Trouble

    4. TROUBLE SHOOTING 4.11 Key Sense Trouble Key Sense sequence of U8500 is : Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V -> Key sensing Start Change the side key Work well?

  • Page 102: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera Trouble Camera control signals are generated by MSM6250 and directly connected with MSM6250. Start Check the camera conn . and reconnect the camera Camera is OK? Check VREG_CAM_2.7V, Change the U501 VREG_CAM_1.8V Check the DSP_CLK Change the Main board (FB502) Change the camera...

  • Page 103: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD Trouble Main LCD control signals are generated by MSM6250. Those signal’s path are : MSM6250 -> MAIN B’d -> CN600 -> LCD FPCB and LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered? trouble shooting...
  • Page 104 4. TROUBLE SHOOTING LCD Control data flow 40pin LCD connector LCD Module FPCB for LCD Module CN600(50pin LCD connector) - 105 -...

  • Page 105: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.14 Keypad Backlight Trouble Key Pad Back Light is on as below : Key pressing -> KEYD_BACKLIGHT go to about 1V -> LED On Key Pad Led controlled by PM6650. Start Key press Check R607 Signal VPWR is OK? Signal KEYD_BACKLIGHT Change the Main board is OK?

  • Page 106: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.15 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event -> Flip(U600 pin 1) is triggered(Open : about 2.6V, Close : 0V) -> MSM6250 Sense the Folder Flip Event. Sensing signal is directly connected to MSM6250. Start Check the magnet in Insert the magnet...

  • Page 107: Camera Direction Detection Trouble

    4. TROUBLE SHOOTING 4.16 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event -> CAM_SENSE(U500 pin out) is triggered as this (Cam front side view : 0V, Cam back side view : about 2.5V) -> MSM6250 Sense the Camera direction change Event Start Check the magnet in the mechanics of camera module And Change the camera direction for front...

  • Page 108: Trans Flash Trouble

    4. TROUBLE SHOOTING 4.17 Trans Flash Trouble Trans Flash is worked as below : Trans Flash insertion -> VREG_MMC_3.0V is 3.0V -> MMC_CD go to High -> Trans Flash Insertion detecting by MSM6250 -> go working Start Check the B -to -B connector for SUB PCB Insert the Trans Flash Card Trans Flash insertion...

  • Page 109: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Audio Trouble Shooting 4.18.1 Receiver Path Voice Receiver path as below: MSM6250 Ear1ON/Ear1OP -> R605,R606 -> CN600(b’d to b’d connector for LCD Module) -> LCD b’d to b’d connector of LCD FPCB -> LCD module -> Receiver Start Connect the phone to network Equipment and setup call...
  • Page 110 4. TROUBLE SHOOTING Receiver FPCB for LCD Module R605,R606(receiver signal serial resistor) CN600(50pin LCD connector) - 111 -...
  • Page 111 4. TROUBLE SHOOTING 4.18.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6250 HPH_R, HPH_L -> CN500 pin 17,18 for SUB b;d -> C907,C911 in SUB b’d -> CN901 headset Jack pin 4,5 in SUB b’d Start Connect the phone to network Equipment and setup call...
  • Page 112 4. TROUBLE SHOOTING CN901 C907,C911 R605,R606(receiver signal serial resistor) CN600(50pin LCD connector) - 113 -...
  • Page 113 4. TROUBLE SHOOTING 4.18.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250 HPH_R, HPH_L -> C508,C509 -> R506,R507 -> U502,U503(amp) -> R500,R501, R502,R503 -> CN600 -> LCD FPCB -> Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Set phone with speaker Phone mode...
  • Page 114 4. TROUBLE SHOOTING Loud Speaker U502,U503(Amp) - 115 -...
  • Page 115 4. TROUBLE SHOOTING 4.18.4 Microphone for Main MIC Main Microphone path as below: MIC -> C534,C535 -> MSM6250 -> MIC feed back gain logic -> MSM internal CODEC MICBIAS C538 C537 SP0102BE3 U505 MIC1N C536 0.022u C534 0.022u C535 MIC1P Near to MSM C533 Start...
  • Page 116 4. TROUBLE SHOOTING U505(MIC for Handset) MICBIAS C538 C537 SP0102BE3 U505 MIC1N C536 0.022u C534 0.022u C535 MIC1P C533 - 117 -...
  • Page 117 4. TROUBLE SHOOTING 4.18.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin6) go 0V -> MSM6250 sense Head_Set insertion -> MIC signal go to MSM(C200, C201) by through b-to-b connector DAUGHTER_HEADSET C914 R905 2.2K R903 CN901 VREG_MSMP_2.7V R907...
  • Page 118 4. TROUBLE SHOOTING C200,C201 for MIC serial capacitor - 119 -...

  • Page 119: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.19 Charger Trouble Shooting USB Cable USB_VBUS (5.0V) Pass control Tr (ON) USB Charging control USB_CNT_N +5V_PWR (4.6V) Pass control Tr (ON) TA Charging control CHG_CNT_N ICHARGE Charging current sensing ICHARGEOUT 4.2~4.25V +VPWR Main VBATT Battery Battery FET (ON) BATT_FET_N Battery charging control...
  • Page 120 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 4.6V? Change TA/USB cable Is the USB voltage 5.0V? Check the Q402,Q403,Q404 Charging OK? Change the board - 121 -...
  • Page 121 4. TROUBLE SHOOTING Q404 Q403 Q402 VBATT - 122 -...

  • Page 122: Download

    LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is desinged to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
  • Page 123 Values. In this case. the figure shown in the below will be displayed. 3. LGMDP User Guide for U8500 7/32 Click on the “Select Port” and check if state shows “Enable” for the port in the “Select Port” window. The current security status will be displayed under Security column.
  • Page 124 4. The status “Ready” is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. U8500 Function Description 1) Image Folder indicates location where all image files are placed.
  • Page 125 1. Select the image folder, where all the image files are located, by clicking on the “Browse...” button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) U8500 U8500 U8500 2.
  • Page 126 5. DOWNLOAD 3. Select the path, where Media Image file is located by clicking on the “Browse...” button. Make sure that you have chosen the right media image file. U8500 U8500 U8500 U8500 U8500 - 127 -...
  • Page 127 5. DOWNLOAD 4. Confirm the information on the message box. U8500 U8500 Caution) Application will popup Error message if you choose improper file. - 128 -...
  • Page 128 5. DOWNLOAD 5. Choose a Module Image file after clicking on the “Browse...” button. U8500 U8500 U8500 U8500 U8500 U8500 - 129 -...
  • Page 129 5. DOWNLOAD 6. Confirm the information on the message box. U8500 U8500 Caution) Application will popup Error message if you choose improper file. 7. Click on the “START” button to download. U8500 U8500 U8500 - 130 -...
  • Page 130 5. DOWNLOAD 3) Downloading This is whole process for downloading. You will see snapshots for each step in the succeeding slides . Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS) Reset Download MODEM Download End...
  • Page 131 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the mentioned local directory as shown. • NV backup in progress. • Erasing the existing directories and files before the Module Image is downloaded. - 132 -...
  • Page 132 5. DOWNLOAD • Downloading the AMSS Modem image • Rebooting and waiting for a while • Performing NV restore - 133 -...
  • Page 133 5. DOWNLOAD • Rebooting the phone and waiting for a while • Erasing the existing directories and files before downloading the Media Image • Download of Media image in progress - 134 -...
  • Page 134 5. DOWNLOAD • Download of Module image in progress • Download process has completed successfully - 135 -...

  • Page 135: Troubleshooting Download Errors

    (AMSS Modem, Media and Module Images can not be running in this mode.) When the phone does not work 1. Port selection parameters when phone is booted in Emergency mode. U8500 U8500 U8500 - 136 -...
  • Page 136 1. Snapshot showing the “MEDIA Erasing error” before downloading the Media Image. Next slide shows the remedial procedure to adopt. U8500 U8500 2. Reboot the phone and then try to download only the Media and Module images again. Both Media and Moule Image have to be downloaded at the same time.
  • Page 137 5. DOWNLOAD NV Restore error 1. Snapshot showing the “NV Restore error”. Next slide shows the remedial procedure to adopt. U8500 U8500 2. Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)
  • Page 138 3. Click on “NV Restore”. A list of NV Backup files(*.nv2) will be shown. These files were saved everytime NV Backup option was selected. The name is based on the time when NV Backup was done. U8500 U8500 U8500 4. Select the appropriate file and click on “Restore”.
  • Page 139 5. DOWNLOAD 5. Snapshot showing the error, Reading the NV file and restore NV. U8500 U8500 U8500 1) Not recommended that multi-downloading using the USB hub. 2) Recommended that the Module and Media Image have to be downloaded at the same time.

  • Page 140: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 BLK diagram USIM PM6650 Receptacle Receptacle BLUETOOTH SPEAKER GSM TX SPEAKER Quadband Quad TX VCO RECEIVER GSM RX SP7T 900/1800/1900 RTR6250 RX FILTER MSM6250 JACK(12pin) WCDMA TX 1.3M UMTS CAMERA UMTS FILTER MAIN WCDMA RX UMTS FILTER...

  • Page 141: Gsm & Wcdma Rf Block

    6. BLOCK DIAGRAM 6.2 GSM & WCDMA RF Block MSM6250 UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 142 -...
  • Page 142 6. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment U1006 M054E FrontEnd Module ASM+Rx saw Common SW1002 KMS512 Test Connector Calibration, etc X1000 TG5001LA-19.2MHz VCTCXO 19.2MHz Bluetooth RF U504 RB06A Bluetooth TRX Transceiver Bluetooth ANT500 Antenna Bluetooth antenna FL1000 ACMD7601 Duplexer FL1001...

  • Page 143: Interface Diagram

    6. BLOCK DIAGRAM 6.3 Interface Diagram U8500 Interface Diagram - 144 -...
  • Page 144 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal...
  • Page 145 - 146 -...

  • Page 146: Circuit Diagram

    C1043 C1045 RX_IP U1000 SBCK R1009 1.2p 680p RX_IM VDDM VREG_MSMP_2.7V RX_QP GRX_IP RX_QM GRX_IM C1020 C1019 VDDA2 GRX_QP GRX_QM U8500 VREG_RFRX_1_2.85V C1049 C1048 0.1u C1058 C1056 RX_QM 0.1u R1004 RX_QP C1018 RX_IM C1017 0.01u C1016 3.9n C1014 C1012 RX_IP 470p 0.1u...
  • Page 147 GSM_PA_EN EBI2_ADD[14] UHF_VCO_0_EN_GPIO[3] AC12 EBI2_ADD[13] AA12 BT_CLK EBI2_ADD[12] BT_CLK_GPIO[25] AF11 EBI2_ADD[11] BT_SBST_GPIO[24] BT_SBST AE11 EBI2_ADD[10] BT_SBCK_GPIO[23] BT_SBCK EBI2_ADD[9] BT_SBDT_GPIO[22] BT_SBDT AC11 EBI2_ADD[8] BT_TX_RN_N_GPIO[21] BT_TX_RX_N AA11 EBI2_ADD[7] BT_DATA_GPIO[20] BT_DATA EBI2_ADD[6] AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] U8500 - 148 -...
  • Page 148 NC73 NC14 NC74 NC15 NC75 OJ1000 OJ3000 OJ4000 NC16 NC76 NC17 NC77 NC18 NC78 NC19 NC79 NC20 NC80 NC21 NC81 NC22 NC82 NC23 NC83 NC24 NC84 NC25 NC85 NC26 NC86 NC27 NC87 NC28 NC88 NC29 NC89 U8500 - 149 -...
  • Page 149 2.2u 1000p C411 C404 4.7u 1000p R401 1608 100K C402 R403 PA_FET_N TCXO_BT_IN TCXO_BT 1000p U400 Q400 Q401 TC7S04FU SI8402DB SI8407DB-T2-E1 VREG_PA +VPWR C400 U401 USB_D- USB_D+ 100K R402 R400 USB_VBUS VREG_W_PA PA_FET_N U8500 RCLAMP0504F C403 0.1u - 150 -...
  • Page 150 SPK_R+ VBAT R501 SPK_AMP_EN _SHDN SPK_R- VBAT_TEMP C506 R1056 VREG_MSMP_2.7V 80.6K VBAT_GND U503 TPA2010D1YZF C504 0.022u 80.6K AMP_PWR R505 PVDD R523 C508 0.022u 80.6K HPL_L AMP_PWR +VPWR R506 R502 U8500 SPK_L+ R503 SPK_AMP_EN _SHDN SPK_L- C550 C505 - 151 -...
  • Page 151 LCD_RESET_N LD603 LD607 KEY_COL(4) R660 R661 LEBB-S14H UCLAMP0505A KEY_COL(3) LD604 KEY_COL(2) LEBB-S14H LEBB-S14H R665 KEY_COL(1) LD611 LD615 KEY_COL(0) R663 R664 LEBB-S14H LD620 LEBB-S14H LEBB-S14H R670 U8500 LD618 LD619 R668 R669 LEBB-S14H LEBB-S14H LEBB-S14H LD621 R674 KYBD_BACKLIGHT LEBB-S14H - 152 -...
  • Page 152 MMC_CD MMC_CMD BAT900 MMC_DATA MMC_CLK V_BACK_UP ML414RH-F9CE RCLAMP0504F VA901 EVLC14S02050 DAUGHTER_HEADSET C914 R905 2.2K R903 CN901 VREG_MSMP_2.7V R907 2.2K MICBIAS MIC2P MIC2N HP_OUT_L C911 HP_OUT_R C907 EAR_SENSE_N MULTI_ADC HOOK_SENSE_N C915 C917 C931 C932 C-1827541 D901 U8500 UCLAMP0505A - 153 -...
  • Page 153 MOTOR_PWR- WLED_1 SPK_R+ WLED_2 SPK_LP SPK_R- WLED_3 SPK_L+ WLED_4 SPK_LN SPK_L- KEY_ROW(2) KEY_ROW(1) KEY_ROW(1) KEY_ROW(3) 53 54 AXT350164G KEY_ROW(2) PLAY / PAUSE RCV_P KEY_ROW(3) Main Connector RCV_N KEY_COL(6) VPWR MOD Key M_PWR TP? TP? VISION MARK U8500 - 154 -...

  • Page 154: Pcb Layout

    8. PCB LAYOUT - 155 -...
  • Page 155 8. PCB LAYOUT - 156 -...
  • Page 156 8. PCB LAYOUT - 157 -...
  • Page 157 8. PCB LAYOUT - 158 -...
  • Page 158 8. PCB LAYOUT U8500 - 159 -...
  • Page 159 8. PCB LAYOUT U8500 - 160 -...

  • Page 160: Calibration

    DLL_E5515CD.DLL E5515C equipment control At_Serial_Cmd.xml AT Serial command PwrSupply_Cmd.xml Power supply command image Graphic image Equipment name Setup_RF_AutoTest.xml Auto set up Model U8500 Model folder 1 B2000 Info_Db.txt Model folder 2 : File : Directory : Summary - 161 -...

  • Page 161: Setup File (Info_Db.txt)

    9. CALIBRATION 9.1.2 Setup file (Info_Db.txt) /*auto*/[Default]=[U8500] ➀ ➁ ➂ /*cal*/[2.75G_ADI_A7150_EDGE]=[.. Cal_Model 2.75G_ADI_A7150_EDGE_Ver0.5_Ezlooks Main_Seq uence.dll] /*auto*/[U8500]=[.. RF_Auto Main_SequenceD.dll] /*auto*/[C1300]=[.. RF_Auto Main_SequenceD.dll] [ezlooks]=[on] You can change this as ‘on’ or ‘off’ [batcal]=[off] (should be in lower case; on, off) [svc]=[off] [standalone]=[off] [tescom]=[off] You can change this as ‘auto’...

  • Page 162: Setup File Item

    [standalone] => Oversea factory or SVC : ‘on’, Domestic factory :‘off’ [tescom] => If you use TESCOM shiedbox, turn it on. [process] => auto process or cal process [U8500] => procedure, spec, setup file name (auto process only) - 163 -...

  • Page 163: Example For Setting File

    9. CALIBRATION 9.1.4 Example for setting file CAL Process AUTO Process Ex1) Service center Ex1) Service center, Oversea factory, repair [ezlooks]=[off] [ezlooks]=[off] [batcal]=[off] [batcal]=[off] [svc]=[on] [svc]=[off] [standalone]=[off] [standalone]=[off] [tescom]=[off] [tescom]=[off] [process]=[cal] [process]=[auto] Ex2) Oversea factory or repair Ex2) Domestic factory [ezlooks]=[off] [ezlooks]=[on] [batcal]=[on]...

  • Page 164: How To Use Hot Kimchi

    9. CALIBRATION 9.2 How to use Hot Kimchi Flow 1.Click the menu which you want. U8500 2.Click APPLY button 3.Click STRAT button This program supports 1024*768*16. - 165 -...

  • Page 165: Hot Kimchi Example

    9. CALIBRATION 9.3 HOT KIMCHI Example U8500 U8500 U8500 U8500_ ver1.1 Choose_U8500 U8500 U8500 U880 U8500 U8500_ ver1.1 Click APPLY button - 166 -...
  • Page 166 9. CALIBRATION U8500 U8500 U8500 U8500_ver1.1 Click START button U8500 *. Click. - 167 -...
  • Page 167 - 168 -...

  • Page 168: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW - 169 -...
  • Page 169 - 170 -...

  • Page 170: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM(FOLDER) TGFF0069601 AAAY00 ADDITION AAAY0093501 Dark Blue BATTERY PACK,...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MPBQ00 PAD,LCD(SUB) MPBQ0022901 Black MTAA TAPE,DECO MTAA0087301 Side_Left MTAA0 TAPE,DECO MTAA0087201 Folder(Upper) MTAA00 TAPE,DECO MTAA0087401 Side_Right MTAB00 TAPE,PROTECTION MTAB0074901 MOD Key MTAC00 TAPE,SHIELD MTAC0031001 SUB LCD Gold MTAE00 TAPE,WINDOW(SUB)
  • Page 172 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MIDA00 INSULATOR,LCD MIDA0018301 0.35T White MIDZ INSULATOR MIDZ0056801 MIDZ0 INSULATOR MIDZ0072701 FPCB_22mm*4mm MIDZ00 INSULATOR MIDZ0063401 FPCB_5.5mm*4mm MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical) MPBF00 PAD,FLEXIBLE PCB MPBF0012501 MPBZ00 MPBZ0104501...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MWAE00 WINDOW,CAMERA MWAE0009801 Dark Blue GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK MCCF00 CAP,MOBILE SWITCH MCCF0030901 Black MCCH CAP,SCREW MCCH0056001 Main_Bracket Dark Blue MCCH0 CAP,SCREW MCCH0056101...

  • Page 174: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark BROWN SACY00 PCB ASSY,FLEXIBLE SACY0036201 GOLD PCB ASSY,...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1008 CAP,CERAMIC,CHIP ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP C1009 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C1010 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C1011 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C1012 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C1013 CAP,CERAMIC,CHIP ECCH0000106...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1044 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1045 CAP,CERAMIC,CHIP ECCH0000141 680 pF,50V,K,X7R,HD,1005,R/TP C1046 CAP,FILM,MPP ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP C1047 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C1048 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1078 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C1079 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP C1080 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C1081 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1082 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C1083 CAP,CERAMIC,CHIP ECCH0000129...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C202 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C203 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C204 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C205 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C206 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C207 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C237 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C238 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C239 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C240 CAP,CERAMIC,CHIP ECCH0000157...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C408 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C409 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C410 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C411 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C502 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C503 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C510 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C511 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D401 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) SOD-323 ,12 V,350 W,R/TP ,Single Line TVS Diode for D500 DIODE,TVS EDTY0006201 SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF , D600 DIODE,TVS EDTY0007601...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L1010 INDUCTOR,CHIP ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE L1011 INDUCTOR,CHIP ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE L1013 INDUCTOR,CHIP ELCH0001426 8.2 nH,J ,1005 ,R/TP ,PBFREE L1014 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP ,...
  • Page 184 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Q404 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 R1001 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1002 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R1003 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1004 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R1040 RES,CHIP ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP R1041 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R1042 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R1043 RES,CHIP ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP R1044 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R1048...
  • Page 186 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R400 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R401 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R403 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R404 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R405 RES,CHIP ERHY0000201...
  • Page 187 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 4-Bump micro SMD ,4 PIN,R/TP ,RF POWER DETECTOR U1001 EUSY0186101 FOR CDMA/WCDMA 28 dBm,42.0 %,0.07 A,-52.0 dBc,27.5 dB,4*4*1.5 ,SMD U1002 SMPY0008201 ,LOAD INSENSITIVE PAM FOR WCDMA (1850-1980M) MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz, U1003 EXSC0009201...
  • Page 188 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA604 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA605 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA606 VARISTOR SEVY0000702 14 V,10% ,SMD , VA607 VARISTOR SEVY0000702 14 V,10% ,SMD , VA630...
  • Page 189 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LD601 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD602 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD603 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD604 DIODE,LED,CHIP EDLH0006001...
  • Page 190 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R510 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R511 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R512 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R523 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R550 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R600 RES,CHIP,MAKER ERHZ0000500...
  • Page 191 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R673 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R685 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP RA600 RES,ARRAY,R ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT U411 EUSY0223002 CONTROL / 2.8V...
  • Page 192 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark PCB ASSY,SUB,SMT SAJC00 SAJC0006101 BOTTOM BAT900 BATTERY,CELL,LITHIUM SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B C905 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C907 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP C911 CAP,TANTAL,CHIP ECTH0004402...

  • Page 193: Accessory

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark BATTERY PACK, 3.7 V,1040 mAh,1 CELL,PRISMATIC ,Muse(U880) Middle SBPP SBPP0013001 Silver...
  • Page 194 Note...
  • Page 195 Note...

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