Huawei MU609 Getting To Know Manual
Hspa lga module
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Also See for MU609:
- Application manual (146 pages) ,
- Hardware manual (81 pages) ,
- Development kit manual (20 pages)
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Copyright © Huawei Technologies Co., Ltd. 2013.
All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei
Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce,
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Notice
Some features of the product and its accessories described herein rely on the software
installed, capacities and settings of local network, and may not be activated or may be
limited by local network operators or network service providers, thus the descriptions herein
may not exactly match the product or its accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or
specifications contained in this manual without prior notice or obligation.
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THE CONTENTS OF THIS MANUAL ARE PROVIDED "AS IS". EXCEPT AS REQUIRED BY
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Summary of Contents for Huawei MU609
- Page 1 Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation.
- Page 2 FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS.
- Page 3 Contents Getting to Know the MU609 ........................... 1 PCB Design ................................2 Assembly................................4...
- Page 4 This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions. You are recommended to read the manual before using the MU609. Getting to Know the MU609 The package of the LGA module is 145 pin LGA with a dimension of 30 mm × 30 mm ×...
- Page 5 PCB Design PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the sizes of the solder pads on customers' PCBs are the same as those of the module's solder pads for the high production efficiency and high reliability of solder joints.
- Page 6 Requirements on PCB Layout The thickness of PCB is more than 1.0 mm (1.2 mm recommended) to reduce the deformation caused by high temperature welding. The minimum distance between the LGA module and the PCB edge is 1.5 mm. Other ...
- Page 7 Design of Solder Mask The PCB pad design can be solder mask defined (SMD), or non-solder mask defined (NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side ...
- Page 9 Reflow Profile For the soldering temperature of the LGA module, see the following figure. Reflow profile...
- Page 10 Reflow parameters Temperature Zone Time Key Parameter Preheat zone (40° C–150° C) 60s–120s Heating rate: 0.5° C/s–2° C/s Soak zone (t1–t2): 60s–120s Heating rate: < 1.0° C/s (150° C–200° C) Reflow zone (> 217° C) (t3–t4): 30s–90s Peak reflow temperature: 230°...