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3.15.1. General Features
• Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory
• Fabricated in advanced low power 0.13•Ïm CMOS technology
• Very low component count (6 external components)
• Ultra low power design
- Peak current 40mA for basic data rate
- Peak current 45mA for enhanced data rate
- Bluetooth low power mode typ. 25µA
• Multiple input clock signals supported (10-40MHz)
• Supply from external voltage regulator 1.8V..3.6V 1)
• Autonomous power down scenarios of Bluetooth and cellular system supported
• Packages:
- P-VQFN-48 package
- P-WFLGA-56 package
• Temperature range from -40°C up to 85°C
• Boundary scan for interface lines via JTAG
3.15.2 Micro-Controller-Section
• ARM7TDMI-STM ARM® Processor for protocol and application software
• Timers + Watchdog + Interrupt Module
3.15.3 Micro-Controller Memory
• 32 KByte RAM
• 256 KByte read only Program Memory
• 8 KByte Patch RAM
3.15.4 Interfaces
• UART (Bluetooth - Interface, support for HCI UART and Three-Wire UART transport layers
with/without hardware handshaking) up to 3.25MBaud
• Two channel PCM Audio interface with I2S mode
• I2C Interface
• Three channel full duplex CVSD trans coder
• General Purpose I/Os
- External interrupt
- Port output levels available during low-power mode (VDD supplied)
• Separate voltage domains for GPIO, UART and PCM interfaces
• Control signal for requesting external (cellular) system clock
• Multi frequency (e.g. 32.768 kHz) low power clock input
3. TECHNICAL BRIEF
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Table of Contents
Troubleshooting
