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Canon BESTEM-D01/R Recognition Setting
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Canon BESTEM-D01/R Recognition Setting

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Die Bonder
Recognition Setting
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Summary of Contents for Canon BESTEM-D01/R

  • Page 1 Die Bonder Die Bonder Recognition Setting...
  • Page 3 Foreword Foreword Foreword Foremost, we would like to thank you for purchasing our [Die Bonder system BESTEM-D01 ]. This machine features automated operation from the bonding of dies on top of supplied lead frame islands until lead frames storage operation. For a long lasting machine, we would appreciate it very much if this operation manual is carefully read through before operating the machine.

  • Page 4: Foreword

    Foreword Foreword Before Using This manual has been prepared for persons who had undergone special training on the machine. Kindly place this manual at a place easy to retrieve for referencing purposes. Please take note of the following cautions before using the machine. ■...

  • Page 5: Table Of Contents

    Contents Contents Foreword Before Using Contents Recognition Setting 1 Recognition Screen Start-up 2 Chip Recognition 3 Island Recognition 4 Pf Recognition 5 DBI/Pf Inspection 6 DBI/Chip Inspection 7 Confirmation function at island recognition NG OM0001 OM0001...

  • Page 7: Recognition Screen Start-Up

    1. Recognition Main Screen MMI main screen will be displayed once the machine is started-up. Click on REC Edit button to display recognition main screen. Please select the item that wish to be inspected from the “Inspection menu” buttons. Chip REC button --- It will change to “chip recognition setting” screen. Pf REC button --- It will change to “Pf recognition setting”...

  • Page 8: Chip Recognition

    BESTEM – D01R 2. Chip Recognition Clicking on Chip REC button in recognition main screen will display the following screen whereby chip recognition teaching can be done. Set according to ①～⑤ sequence. ⑥、⑦ is other inspection execution button. ③ ① ②...
  • Page 9 BESTEM – D01R ⑤ REC exe button Carry out chip recognition trace position. Check if the parameters are correct. Others Command ⑥ OriFlat exe button Execute orientation flat checking. Check if the parameters are correct. ※Wafer table has to move to orientation flat position. ⑦...
  • Page 10 BESTEM – D01R Tab items are explained as follow. Set according to the procedure below. 【Chip base】--- Normal User If「Chip Base」 tab is clicked, the right screen will be displayed. “REC result display”--- Sets recognition results display. “Chip base parameter setting” ①...
  • Page 11 BESTEM – D01R 【Chip base】--- Super User In Super User chip base tab is clicked, the right screen will be displayed. ①Resolution --- Camera pixel resolution is set. ②Exposure time --- Camera exposure time is set. ③Focus monitor --- The focus of the camera is adjusted. ※There is a set part of the focus monitor also in a base tab of the super user of the island recognition and the Pf recognition, and do a necessary adjustment according to each camera,...
  • Page 12 BESTEM – D01R 【Template】 When「Template」tab is double clicked, a screen as on the right will be displayed. Position set parameter setting method ① Position set method --- Selects positioning method during chip recognition. ② Matching rate [％] --- Sets chip pattern matching rate（％）.
  • Page 13 BESTEM – D01R 【NG mark detect】 When 「NG Mark」tab is clicked, the screen as on the right will be displayed. “NG mark parameter setting” ① “NG mark detect”--- Sets NG mark detection “Execute/No execute”. ② “NG pickup” Sets NG mark chip pick up “Execute/No execute”...
  • Page 14 BESTEM – D01R 【Chipping detect】 When「Chipping」tab is clicked, a screen as on the right will be displayed. “Chipping detect parameter setting” ① “Chipping detect” Sets chipping detection “Execute/No execute” during chip recognition. ② “Chipping detect XY position inside pixel” --- Sets chipping detection position during chip recognition.
  • Page 15 BESTEM – D01R 【Orient Flat check】 When「Orient Flat」tab is clicked, a screen as on the right will be displayed. “Orient flat check parameter setting” ① “Orient flat check” Sets orient flat check “Execute/No execute” when set the wafer. ② “3 level scale setting” Sets “3 level setting”...

  • Page 16: Island Recognition

    BESTEM – D01R 3. Island Recognition When island recognition button in recognition main screen is clicked, the below screen will be displayed and island recognition teaching can be done. Set in ①～③ sequence. Set AgP recognition setting screen as procedure in island recognition screen. (Explanation will be abbreviated here). Basic screen and basic operation is as chip recognition.
  • Page 17 BESTEM – D01R ⑤ Digital zoom This setting is use to zoom the image to obtain the image divided area which include the island size. (Setting range: 1 ~ 30 ) (Note 1) ⑥ Island position move button (Note 2) It can be moved to the setting island position as in auto run mode.
  • Page 18 BESTEM – D01R Tab items are explained as following. Set according to sequence below. 【Island base setting tab】 If「Island base」tab is clicked, the right screen will be displayed. “REC results display”--- Sets recognition results display. “Island base parameter setting” ① “Side illumination”--- Sets side illumination during chip recognition.
  • Page 19 BESTEM – D01R ⑥ “Frame front row inspect selection” The search area position for frame first row search is automatically corrected. This corrected search area position will be kept until the next frame first row inspection checking. If “No Execute” is selected, search area position will return to center of view area. first island Search area ⑦...
  • Page 20 BESTEM – D01R 【Template setting tab】 When 「Template」 tab is clicked, a screen as on the right will be displayed. “Alignment position detect parameter setting” ① “Position set method” --- Matching center only. ② “Position detect method” --- 1 point REC only. ③...
  • Page 21 BESTEM – D01R chip position cursor Template origin island ⑨ “Mask prohibition region” --- Select whether “Execute (Region 1, 2) / Not use”. If select to execute, after select the region shape “Box/Round”, click Setting button, then please set the mask prohibition region. Mask prohibition region No.
  • Page 22 BESTEM – D01R 【Mask prohibition region setting procedure】 Setting is done in Pf recognition (Island recognition) recognition edit window. The setting content is as described below: ① The view center is set according to the island center which is set by “image region setting”. ※During teaching, please use an obvious island.
  • Page 23 BESTEM – D01R 【NG mark setting tab】 When 「NG mark」 tab is clicked, a display as on the right will be displayed. “NG mark detect parameter setting” ① “NG mark detect” --- Set NG mark detection “ON/OFF” during island recognition. ②...

  • Page 24: Pf Recognition

    BESTEM – D01R 4. Pf Recognition When Pf recognition button in recognition main screen is clicked, the below screen will be displayed and Pf recognition teaching can be done. 「Pf Base」 , 「Template」 , 「NG Mark」 setting and the procedures for Pf recognition are same as Island recognition (will not explain here).
  • Page 25 BESTEM – D01R Reference Figure) 1st chip detection for chip at outside image view. Machine backward Image view during setting 1st chip detection 1st chip detection window 1st chip Y Offset Setting ※Regarding polarity, if 1st chip is behind the island (machine backward), setting is + value.

  • Page 26: Dbi/Pf Inspection

    BESTEM – D01R 5. DBI／Pf Inspection When DBI/Pf Inspection button in recognition main screen is clicked, the following screen will be displayed and DBI/AgP Inspection teaching can be done. Set according to ①～⑤ sequence. Set basic screen and basic operation as in chip recognition. ①...
  • Page 27 BESTEM – D01R ⑥ Adjust exe button Execute island positioning recognition. Island position will be compensated. ⑦ Check Image button View the last check monitor image. ⑧ Digital zoom This setting is use to zoom the image to obtain the image divided area which include the island size. (Setting range: 1 ~ 30 ) ⑨...
  • Page 28 BESTEM – D01R Setting procedure for DBI-Pf inspection parameter setting. 1) Normal user Pf Base tab items The function for Image region setting button is already moved to image view main menu. This function button cannot be used). 2) Super user Pf Base tab items Carry out DBI-Island REC execute SW setting in SuperUser Pf Base tab.
  • Page 29 BESTEM – D01R 3) Normal user Pf Position/quantity tab Description on Pf position/quantity tab. Set according to the following step. 【Pf Position/quantity】 1. When click 「Pf position/quantity」 tab, the right display will appeared. 【Odd Column (Standard) tab】･･･ Odd row island use DBI-Pf detect windows setting is possible.
  • Page 30 BESTEM – D01R ② “Limit volume”--- Sets Pf dispense volume detection allowable range. ［unit：%］ Lower limit: 0% ~ 100%. Upper limit: 100% ~ 200%. ③ “Warn volume” --- Sets AgP dispense volume detection warning volume. ［unit：%］ Lower limit: 0% ~ 100%. Upper limit: 100% ~ 200%. ※Pf dispense detection tolerance range setting is common for both Even/ Odd rows.
  • Page 31 BESTEM – D01R 【Island that required Odd and even detect windows】 Odd row Even row Island Ag Paste Detect windows (Odd row (standard) setting) Detect windows (Even row setting) ※Even row detect windows is when “Island selection” is set to “2 island”, then 『Even row』 tab setting detect windows is valid.

  • Page 32: Dbi/Chip Inspection

    BESTEM – D01R 6. DBI／Chip Inspection When DBI/Chip inspection button in recognition main screen is clicked, the following screen will be displayed and DBI/chip inspection teaching can be done. Set according to ①～③ procedure. Basic screen and basic operation is as in chip recognition setting. ①...
  • Page 33 BESTEM – D01R ⑤ Digital zoom This setting is use to zoom the image to obtain the image divided area which include the island size. (Setting range: 1 ~ 30 ) ⑥ Island position move button (Note 1) It can be moved to the setting island position as in auto run mode. Please specified the island no.
  • Page 34 BESTEM – D01R Setting procedure for DBI-chip inspection parameter setting tab. Description on the tab items. Set according to the following step. 1) Normal user Island Base tab items ・In normal user Island base tab, set the image region with Image region setting tab.
  • Page 35 BESTEM – D01R 3) Normal user Chip Template tab item Please carry out setting for each item in chip template tab. 【Chip Template】 When 「Chip Template」is double click, the bottom right display appear. (1) DBI-die (chip) position detect parameter setting ①...
  • Page 36 BESTEM – D01R ｢Requirement｣ 1. Regarding Easy button, island recognition unit first chip offset value as standard will be automatically set. 2. Easy button setting value is in unit 1 pixel. ※ Easy button upside has a Setting button which the setting value unit is 1/100 pixel designed for minor adjust purpose.
  • Page 37 BESTEM – D01R 【Pf Protrude】 Click 「Pf Protrude」tab and the right display will appear. This function is referring to DBI chip inspection on paste protrude detection. The detection is done on 4 side. For detection window position, the chip up/down detection window and left/right detection window can be set separately.
  • Page 38 BESTEM – D01R The parameter explanation for paste protrude detection is as below: Name Description Range Unit ‐‐ 1-① Pf spread out DBI Selection SW whether to execute paste protrude detection in 0～1 inspection execution DBI chip recognition process. ‐ select SW (0：Not Use/1：Execute) 1-②...
  • Page 39 BESTEM – D01R Name Description Range Unit 2-④ Left side high volume The setting for chip left side detection window detected high pixel 0～999999 warning volume warning limit. The protrude quantity above this limit will be given warning. Left side low volume The setting for chip left side detection window detected pixel 2-④...

  • Page 40: Confirmation Function At Island Recognition Ng

    BESTEM – D01R 7. Confirmation function at island recognition NG This function has aimed for the island that became an island recognition error at automated cruise to specify how to treat in the next automated cruise. Two kinds of functions can be greatly specified. ・...
  • Page 41 BESTEM – D01R ① Skip registration button The island number of which it made an error is skipped. ② BD position specification button It changes to the BD position and specification screens. ③ Cancel button Registered skip information and BD position and specification information are released. ④...
  • Page 42 BESTEM – D01R 【BD position and specification screens】 This screen opens when the BD position specification button is pressed on the island recognition confirmation screen. The island number ① ② ③ ① Registration button The specified point is registered, and it returns to the island recognition confirmation screen. ②...
  • Page 43 Die Bonder BESTEM-D01R Operation Manual Recognition setting Initial Issuance August 2003 ■Issued By ：CANON Machinery Corporation Production Division Research & Development...
  • Page 44 CANON Machinery Corporation Head Office & Factory ： 85 Minami-Yamadacho, Kusatsu-shi, Shiga 525-8511, Japan. TEL (077)565-0755 Fax, (077)565-0755 Shanghai Office ： #903 Shanghai Kerry Centre, 1515 Nanjing Road West, Shanghai 200040, China TEL86-21-5298-5101~2 Taipei Office ： 5f-3,No.390,Fu Hsing South Road, Sec.1,Taipei 16847778,Taiwan TEL886-2-2709-5122 http://www.canon-machinery.co.jp/...

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